1. The application time of solder paste is limited. After exceeding theapplication time limit, the soldering flux will change and the welding will bepoor.
2. The viscosity of the solder paste itself is not good, and problemssuch as oscillation and swaying of the meta-equipment during the transferresult in the displacement of the meta-equipment.
3. The flux content in the solder paste is too high, and excessive fluxactivity in the reflow process leads to the displacement of components.
4. During the transfer process after printing and pasting, thedisplacement of the meta-equipment is caused by vibration or incorrect transfermode.
5. When 5. PCBA is processed, the air pressure of the suction nozzle isnot adjusted properly, and the pressure is not good, resulting in thedisplacement of components. The mechanical problems of the mounter itselfcaused the wrong placement orientation of the components.
6. Once the components shift in the process of chip mounting, it willaffect the operational performance of the circuit board. Therefore, in theprocess of processing, it is necessary to understand the reasons for thecomponents shift and stop the disposal.